发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:The titled composition excellent in anticorrosiveness and cracking resistance and well adaptable for, e.g., an increasing elaborateness of wirings, comprising a polyepoxy compound, a phenol novolak compound, PVA or its partial acetalization product and an inorganic filler. CONSTITUTION:A 100pts.wt. polyepoxy compound having at least two epoxy groups in the molecule (e.g., bisphenol A diglycidyl ether) is kneaded by agitation with 10-80pts.wt. phenol novolak compound having at least two phenolic hydroxyl groups in the molecule (e.g., cresol novolak resin), 0.1-20pts.wt. PVA or its partial acetalization product of the formula (wherein >=5), 0-1,000pts.wt. inorganic filler such as fused silica and, optionally, a cure accelerator (e.g., imidazole).
申请公布号 JPS61151232(A) 申请公布日期 1986.07.09
申请号 JP19840273216 申请日期 1984.12.26
申请人 TOSHIBA CORP 发明人 FUJIEDA SHINETSU;YOSHIZUMI AKIRA;HIRAI HISASHI;MATSUMOTO KAZUTAKA
分类号 C08G59/00;C08G59/62;C08L63/00 主分类号 C08G59/00
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