| 摘要 |
PURPOSE:To obtain a lead frame having high reflecting efficiency, whose production cost can be reduced, without deteriorating quality due to yield of rust and the like, by providing a double structure of silver plated layers only in the vicinity of a reflecting plate, and forming the other region of the silver plated layers very thinly. CONSTITUTION:A lead frame 21 is formed by, e.g., blanking a sheet of a metal plate body. At the end part of said lead frame 21, a dish shaped reflecting plate 22 is formed by, e.g., press machining. A semiconductor light emitting element 11 using GaP is mounted on the central part of the reflecting plate 22. On the entire surface of the frame 21 including the dish shaped reflecting plate 22, at first a copper plated layer 23 is deposited and formed. On the surface of the copper plated layer 23, a first silver plated layer 24 is deposited and formed in correspondence with only the vicinity of the reflecting plate 22. A second silver plated layer 25 is formed very thinly in the vicinity of the reflecting plate 22 including the first silver plated layer 24 and the entire surface of the surrounding part thereof. At this time, the first and second silver plated layers 24 and 25 are laminated in the vicinity of the reflecting plate 22. |
