发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To improve bondability by removing the effect of heat for automatically heating a bonded matter at the time of wire bonding work is stopped. CONSTITUTION:A bonding head 6 is provided on an X-table 11 and a Y-table 12 and each table is connected to motors 13, 14. The motors 13, 14 are driven by a program made with the driving system 15 and the control system 16 of the X-Y tables. The position of bonding is recognized by a TV camera. The control system 16 which has the function of a computer controls the X-Y tables and the Z axis of the bonding head and if the stop of bonding is detected, the bonding head 6 is immediately made to retreat to be protected against the heat for heating a lead frame 2.
申请公布号 JPS61148827(A) 申请公布日期 1986.07.07
申请号 JP19840270683 申请日期 1984.12.24
申请人 TOSHIBA CORP 发明人 ATSUMI KOICHIRO;ANDO TETSUO
分类号 H01L21/60 主分类号 H01L21/60
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