| 摘要 |
PURPOSE:To enable to form a thin resin coating on the surface opposite to the surface of a chip for heat dissipating support plate in a favorable manner by a method wherein liquefied resin is injected into a resin sealed type forming space through an injection hole located in the vicinity of a tip of a supporting plate. CONSTITUTION:A lead-frame is placed into molds 29, 30 and the top force 29 and the bottom force 30 are joined together and are subjected to mold clamping. At that time, lead 22a, 22b and 22c are clamped by grooves 36a, 36b and 36c respectively. As the result, a supporting plate 31 is disposed in levitated state in a space 32 formed by the molds 29, 30. The upper part space 32a is disposed to be wide and the lower part space 32b is disposed to be narrow. Because a projecting part 29b is installed to come to intersect with an injection direction of resin shown by an arrow 40, flow of resin is restricted, and consequently, flow of resin is strengthened relatively in the narrow space 32b placed under the supporting plate 21. By this configuration, sealing flow at the upper space 32a and the lower space 32b are well-balanced and unfilled state, which has been generated in the lower space 32b so far, is observed hardly. |
