发明名称 SOLDERING METHOD
摘要 PURPOSE:To eliminate defective soldering arising from the drippings and bridges formed in a soldered part in the stage of soldering with a jet soldering device having a wave regulating plate by covering the molten solder surface on at least the ejection side of the work under movement with a floating medium. CONSTITUTION:A fence 11 for the floating medium is provided to enclose the periphery of the wave regulating plate 2b on the entry side of a nozzle 2 except part thereof and the lower part thereof is dipped into the molten solder contained in a solder tank 1. Activated rosin flux or the like is contained as the floating medium into the space provided between the fence 11 and the nozzle 2 and the floating medium layer is formed on the surface of the molten solder. The layer covers the surface on the ejection side of a printed circuit board (a) except the top part of the molten solder ejected from an ejection port 2a. The molten solder on the plate 2c side on the ejection side returns to the tank 1 by penetrating through the floating medium layer. The defective soldering is thus decreased if the circuit board (a) is soldered by bringing the same into contact with the molten solder while moving the circuit board.
申请公布号 JPS61147965(A) 申请公布日期 1986.07.05
申请号 JP19840266477 申请日期 1984.12.19
申请人 ISHII GINYA;MIYANO YOSHIHIRO 发明人 ISHII GINYA;MIYANO YOSHIHIRO
分类号 B23K1/08;B23K3/06;H05K3/34 主分类号 B23K1/08
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