发明名称 ROTARY DRYING METHOD AND APPARATUS
摘要 PURPOSE:To rotatably dry a wafer and to prevent the static electricity from removing from the wafer by blowing to the wafer air corona discharged while rotating the wafer. CONSTITUTION:A wafer 5 is dried by rotating the wafer 5 at a high speed. Air is corona discharged by corona discharging high voltage electrodes 8, and O2 in the air is altered to O3. The corona discharged air is blown through an air spraying nozzle 6 tilting laterally at the neck to the wafer 5 rotating at a high speed by high pressure to enhance the drying effect of the wafer 5. At this time, a vessel 1 is filled by corona discharged air to neutralize the generated static electricity.
申请公布号 JPS61147535(A) 申请公布日期 1986.07.05
申请号 JP19840270061 申请日期 1984.12.21
申请人 TOSHIBA CORP 发明人 SASAKI SHIGEO
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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