| 摘要 |
PURPOSE:To obtain a resin excellent in flexibility, heat resistance, etc., by reacting a component comprising 2,8-diaminodiphenylene oxide and 4,4'- diaminodiphenyl ether with an aromatic tetracarboxylic acid dianhydride. CONSTITUTION:An aromatic diamine component comprising 2,8-diaminodi phenylene oxide and 4,4'-diaminodiphenyl ether as essential components each in an amount of at least 10wt% and, optionally, other aromatic diamines (e.g., m-phenylenediamine) is reacted with an aromatic tetracarboxylic acid dianhydride (e.g., pyromellitic dianhydride or benzophenonetetracarboxylic dianhydride) and the product is imidated to obtain the purpose heat-resistant polyimide resin. The obtained resin can be suitably used for forming, e.g., coat ing films for protecting the surfaces of electronic parts.
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