| 摘要 |
<p>PURPOSE:To realize the titled device of small size and relatively low cost subjected to both-surface mounting, by a method wherein about a double number of terminals are installed by having the intervals of terminals, and the terminals of increment are utilized for the electrical connection between both surfaces of the substrate. CONSTITUTION:Chip components 2-a, 2-b are mounted on both surfaces of a thick film both-printed substrate 1 with adhesive resin. Three terminals unnecessary as outer terminals can be utilized for the electrical connection of both surfaces by installing seven outer terminals 3 at 1.27mm intervals to the spaces which originally need four outer terminals at 2.54mm intervals. Next, soldering is carried out by putting the whole substrate in a solder melt bath, and parts 3-b unnecessary as outer terminals are cut.</p> |
