SEMICONDUCTOR ASSEMBLY APPARATUS

摘要

PURPOSE:To enable pellets to be directly picked up from a wafer ring before bonding by providing a wafer ring supplier automatically exchanging the wafer ring located in the state that pellets formed by dicing a wafer keeps the positional relation present in dicing. CONSTITUTION:When pellets 10 capable of bonding run out during the action of picking up pellets 10 in a wafer ring 8 set at the pick-up position on the wafer ring supplier 7, this mechanism 7 is rapidly moved to the direction parallel with a chute 3. Other wafer rings 8 set in adjacency on the wafer ring supplier 7 are set at the pick-up position immediately under a pick-up arm 9, and the pick-up pellets 10 by the arm 9 and their carriage to the middle stage 11 can be continuously carried out without breakings, and bonding action by a bonding arm 12 is continuously carried out.