Solder method for providing standoff of device from substrate,申请号US19650466625-传众专利搜索

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发明名称	Solder method for providing standoff of device from substrate
摘要
申请公布号	US3392442(A)	申请公布日期	1968.07.16
申请号	US19650466625	申请日期	1965.06.24
申请人	INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	NAPIER JOHN;JR. RUPERT F. ROSS,
分类号	B23K1/19;H01L21/60;H01L23/485;H05K3/34	主分类号	B23K1/19
代理机构		代理人
主权项
地址

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