发明名称 PRODUCTION OF EPOXY RESIN LAMINATED BOARD
摘要 <p>PURPOSE:To obtain the titled laminated board having excellent moldability, drillability, and thermal shock resistance, by laminating prepregs prepared from a varnish composed mainly of a non-brominated bisphenol A-type epoxy resin, etc. having an epoxy equivalent falling within a specific range, and hot- pressing the laminate. CONSTITUTION:The objective laminated board can be produced by hot-pressing the laminate of prepregs prepared from a varnish containing epoxy resin component composed mainly of (A) a non-brominated bisphenol A-type epoxy resin having an epoxy equivalent of 600-950 and (B) a bisphenol A-novolac epoxy resin (preferably a resin expressed by the formula and having a molecular weight of 450-1,400). The weight ratio of the resin A to the resin B (A/B) is (60-90)/(40-10).</p>
申请公布号 JPS61138621(A) 申请公布日期 1986.06.26
申请号 JP19840259986 申请日期 1984.12.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 IKETANI KUNIO;OTORI TOSHIYUKI;TANAKA YOSHITAKE
分类号 C08G59/00;B32B27/38;B32B37/00;C08G59/20;C08G59/32;C08G59/50;C08J5/24;C08L63/00;H05K1/03 主分类号 C08G59/00
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