| 摘要 |
PURPOSE:To prevent the oxidation and corrosion of a heating resistor layer and a conductor layer due to the infiltration of moisture or the like, by arranging the wiring pattern consisting of a heating resistor layer and a conductor layer other than terminal parts inside the film forming range of a protection layer. CONSTITUTION:The individual conductor pattern parts 5a-5g wired from heating resistor parts 4a-4g and a common conductor pattern 5h are formed inside the chip contour other than terminal parts 8a-8h. The pattern formation thereof is carried out when etched in photo process after spattering of the thermal resistor layer 4 and conductor layer 5. Further, the film of the protection layer 9 consisting of an oxidation resistant layer 6 and a wear resistant layer 7 is formed over all the surface of substrate. Therefore, when the chip is separated after processing the terminal part with Ni/solder, the protection layer is covered to the peripheral line of chip. Thereby, the infiltration of moisture from the peripheral section part of chip can be prevented. |
