发明名称 REFLOW SOLDERING DEVICE
摘要 PURPOSE:To obtain the soldering component having the necessary solder thickness irrespective of how being the state of disturbance by operating the solder thickness by detecting the displacement between the materials to be joined and cutting off the current in case said solder thickness coincides with the set value. CONSTITUTION:A fixed value is taken for the output waveform due to the displacement of a heater 5 being constant immediately before starting the electrification. In this case the output waveform of the setting circuit 19 of the discharging solder quantity is set at the prescribed value. On starting the electrification the output waveform of an arithmetic circuit 15 is slightly raised by the thermal expansion of the heater 5 but due to the arithmetic circuit 15 and peak holding circuit 16 showing the same value the output waveform of a differential circuit 17 is kept in zero. When the time to start the melting of the solder 3 comes thereafter, the output waveform of the arithmetic circuit 15 shows the peak value and the peak holding circuit 16 holds the value at this moment. And the output waveform of the differential circuit 17 is reduced as well together with the reduction in the output waveform of the arithmetic circuit 15 and at the time when coinciding with the output value of the output waveform of the discharging solder quantity setting circuit 19 the output waveform of the comparison circuit 20 rises to a fixed value from zero and the current is cut off.
申请公布号 JPS61135476(A) 申请公布日期 1986.06.23
申请号 JP19840256903 申请日期 1984.12.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 KASHIBA YOSHIHIRO;SAITO TAKASHI
分类号 H05K3/34;B23K3/00;B23K3/04 主分类号 H05K3/34
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