| 摘要 |
PURPOSE:To obtain the titled new composition with high heat resistance, solubility, film formability, etc., useful for electrical insulating varnish, etc., by the reaction, in the presence of polyamide resin, between dibasic acid and polyisocyanate. CONSTITUTION:The objective composition can be obtained by the reaction, in the presence of a polyamide resin (e.g., nylon 6) in a solvent such as phenol, using catalyst if needed, at 150-250 deg.C for 2-20hrs. between (A) a dibasic acid (pref. an aromatic dibasic acid such as isophthalic acid) or its derivative and (B) a polyisocyanate (pref., an aromatic diisocyanate such as 4,4'- diphenylmethane diisocyanate) in an equivalent ratio (A)/(B) of 1/1-1.4. Incorpo ration of said composition with 3-40wt.% of a phenolmasked aromatic polyisocyanate will be effective in terms of foaming prevention.
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