发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To decrease power source noises, by providing inner leads, which connect a plurality of pins to an IC chip having a power source pad, and providing a wiring, which connects the power source pad to one of the inner leads that have the shortest length. CONSTITUTION:A power source line of an IC chip 21 is assigned to a sixth pin 25, whose inner lead length is the shortest. The length of the inner lead 24 of the sixth pin 25 is the shortest in the same way as the lengths of a fifth pin 26, a 15th pin 27 and a 16th pin. Therefore, the length of the wiring of the power source in a semiconductor device, in which the power source line is arranged on the sixth pin 25, is reduced to about 1/4 the conventional length. Thus, the inductance becomes low, and power source noises are decreased to a large extent.
申请公布号 JPS61133651(A) 申请公布日期 1986.06.20
申请号 JP19840255414 申请日期 1984.12.03
申请人 NEC CORP 发明人 KANEDA KENICHI
分类号 H01L23/50;H01L23/64 主分类号 H01L23/50
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