| 摘要 |
PURPOSE:To prevent the generation of disappearance of a transparent electrode lead section by forming a metallic thin-film to a shape that it is superposed to a transparent electrode pattern and also coating an exposed transparent conductive film with a resist at the same time as a photo-resist pattern for forming a metallic lead electrode is shaped from the metallic thin-film and etching the metallic thin-film. CONSTITUTION:A transparent conductive film is formed in a region, in which a transparent electrode pattern must be shaped, on a glass substrate 10, a transparent electrode 21 is patterned, and a metallic thin-film 40 is evaporated by using Al, etc. The thin-film 40 is evaporated by employing a metallic mask because one part of a lead section 23 for the transparent electrode 21 is coated with the thin-film 40 and the evaporation is limited in a region, in which a metallic lead electrode 42 must be shaped. The precision of the superposition of the metallic thin-film 40 and the transparent electrode lead section 23 need not be improved because allowance can be taken in a contact section between the lead section and the metallic lead electrode by previously setting the lead section 23 for the transparent electrode in proper length, and a photo-resist pattern is shaped in a region 71. The metallic thin-film 40 is etched, and a resist is removed, thus obtaining an excellent pattern for the metallic lead electrode 42. |
