| 摘要 |
PURPOSE:To form a plating layer of a uniform thickness, by arranging a centering die and drawing die corresponding to the thickness of the plating layer by aligning the axes of the dies and pulling out a wire rod while a molten plating metal is supplied when hot dip plating is performed on the wire rod. CONSTITUTION:A copper wire 6 is dipped in a tank 9 filled with a molten alloy of Sn-Pb by means of an after-feeding roller 8 after the surface of the wire 6 is cleaned in a pre-treatment tank 7 and pulled up vertically by means of feeding rollers 11 and 12. The copper wire 6 covered with the molten plating alloy is passed through a die 1 provided with a copper wire centering hole 3 whose central axis coincides with the surface of the molten plating metal 10, drawing hole 2 which adjusts the thickness of the plating metal, and a molten plating alloy supplying port 4, and an alloy-plated wire provided with a plating layer of a thickness corresponding to the diameter of the drawing hole 2 is pulled up. Then the plated wire is cooled by a cooling device 13 and the molten plating metal is solidified and the plated wire 14 thus formed is wound. When a die having plural holes of plural diameters which becomes larger gradually is used, a plated wire provided with a plating layer of a necessary and uniform thickness can be manufactured easily. |
