发明名称 WIRING PROCESS
摘要 PURPOSE:To substancially decrease the processing time and storage area in comparison with the case where the whole substrate is wired together, by separately wiring the high-density substrate. CONSTITUTION:The dividing means for a wiring region 1 divides a substrate into arbitrary wiring regions while inputting the one set of the starting and ending points co-ordinates to be connected to the wiring substrate into the first memory means 2 and registering them in the wiring table. The determination means 3 checks whether there is a need to divide the starting and ending points co-ordinates for each region, and, if the starting and ending points co-ordinates are in the different regions, that is to say that the separation is required, the starting and ending points co-ordinates dividing means 4 divides the starting and ending points co-ordinates for each region and determines the starting and ending points co-ordinates on each region. The first co-ordinates transformation means 5 transforms the starting and ending points co- ordinates assigned for each region in the relative co-ordinates from the reference points in the concerned region and registers them in the first memory means 2. When an in-region path is obtained with the in-region path determination means 7, the path is registered in the wiring completion table within the second memory means 9 after having been transformed into the absolute co-ordinates for the whole substrate with the second co-ordinate transformation means 8.
申请公布号 JPS61128543(A) 申请公布日期 1986.06.16
申请号 JP19840250216 申请日期 1984.11.27
申请人 NEC CORP 发明人 TAKANO NOBUO
分类号 H05K3/00;G06F17/50;H01L21/82 主分类号 H05K3/00
代理机构 代理人
主权项
地址