| 摘要 |
PURPOSE:To obtain a solid-state image pick up device of extremely compact in size and having no failure due to light reflection flare and the like by laminat ing a transparent member on a photosensitive surface of a solid-state image pick up element chip and sealing hermetically the chip. CONSTITUTION:A solid-state image pick up element chip 11 bonded and fixed to an inner bottom surface 14A of a ceramic substrate 14 of a package structure by a bonding agent 15. On a photo-sensitive surface side of the chip 11, a trans parent glass base plate 19 is laminated through a transparent bonding agent 18 by a direct bonding and fixed to have a transparent body. Thereby, the solid state image pick up element chip 11 prevents its surface from contacting an external atmosphere. Under such a condition, further between the solidstate image pick up element chip 11, the circumference of the glass substrate 19 and the ceramic substrate 14, for protection of a bonding wire 17, an hermetic sealing of the chip 11 and a strong fixing, a resin 20 is filled.
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