发明名称 |
Framework for components. |
摘要 |
<p>The invention provides a framework having synthetic resin projections (2-6) the framework also serving as a printed circuit board.
<??>The invention moreover provides the possibility of making an electrically conductive lead-through (14) in a printed circuit board based on a metal mounting plate (11) without an electrically conductive connection with the mounting plate (11) or with other lead-throughs being formed. </p> |
申请公布号 |
EP0184245(A1) |
申请公布日期 |
1986.06.11 |
申请号 |
EP19850201852 |
申请日期 |
1985.11.12 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
ACCOU, JAN FIRMIN |
分类号 |
H05K7/04;H05K1/00;H05K1/05;H05K1/11;H05K3/30;H05K3/44 |
主分类号 |
H05K7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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