发明名称 Framework for components.
摘要 <p>The invention provides a framework having synthetic resin projections (2-6) the framework also serving as a printed circuit board. &lt;??&gt;The invention moreover provides the possibility of making an electrically conductive lead-through (14) in a printed circuit board based on a metal mounting plate (11) without an electrically conductive connection with the mounting plate (11) or with other lead-throughs being formed. </p>
申请公布号 EP0184245(A1) 申请公布日期 1986.06.11
申请号 EP19850201852 申请日期 1985.11.12
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 ACCOU, JAN FIRMIN
分类号 H05K7/04;H05K1/00;H05K1/05;H05K1/11;H05K3/30;H05K3/44 主分类号 H05K7/04
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