| 摘要 |
PURPOSE:To contrive to heat uniformly and to enhance the radiating efficiency and consequently enable to make the title device thinner by a structure wherein a heating body is laid along a heat conductor and heat conductive hardening material is filled in spaces coming between the heating body and the heat conductor by such proper thicknesses at proper portions as to develop the required temperature distribution in the heating body. CONSTITUTION:A heating body consisting of a pipe, through which heat transfer medium passes, is arranged onto the surface of a heat conductive heating plate 4 so as to tightly contact with the heating plate 4 by pressing the pipe with clamps 8 at several positions along the pipe. In addition, heat transfer cement or heat conductive hardening material 10 such as Salmon is filled in recesses formed by the pipe 1 and a radiator plate 4. Said Salmon is putty-like material with high heat conductivity and hardened with time after being filled so as to strongly bond to both the radiator plate and the pipe in order to form seamless heat conductive passages. Thus, the distribution of heat transfer of the title device can be changed as desired and consequently the title device can be made thinner. At the same time, because the thermal conductivity from the heat absorbing/radiating pipe to the heat absorbing/radiating plate is controlled, good thermal efficiency is resulted. |
