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发明名称
MANUFACTURE OF RESIN DIPPED PACKAGE TYPE ELECTRONIC COMPONENT
摘要
申请公布号
JPS61117817(A)
申请公布日期
1986.06.05
申请号
JP19840238263
申请日期
1984.11.14
申请人
HITACHI CONDENSER CO LTD
发明人
TANAKA TERUMITSU;MATO MASAYUKI
分类号
H01C17/02;H01G4/00
主分类号
H01C17/02
代理机构
代理人
主权项
地址
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