发明名称 FORMATION OF THIN FILM
摘要 PURPOSE:To form a thin film of uniform thickness on the entire region by supplying RF power to each of 3-5 electrode lines of odd and even numbers from a single unit of power supply through a matching circuit and electrical element and by changing electrical constants of electric elements. CONSTITUTION:The electrical elements 13b, 13d are connected between the terminal 12a of matching circuit 12 and electrodes 9b, 9d of even numbers, while the electrical elements 13a, 13c, 13e between the terminal 12b and electrodes 9a, 9c, 9e of odd numbers. Connecting method, position and kind of electrical element are selected so that uniform discharge of each discharge region becomes uniform. At the time of forming a thin film, raw material gas is introduced to the vacuum condition and RF power is also supplied to each electrode to form plasma between electrodes and discharge intensity of regions is set uniform by adjusting electrical elements. Therefore, it is advantageous to use a variable capacitance and variable coil. According to this structure, a thin film of uniform thickness can be formed in respective regions even with the lateral plasma method having a plurality of discharge regions.
申请公布号 JPS61116826(A) 申请公布日期 1986.06.04
申请号 JP19840238109 申请日期 1984.11.12
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 NISHIMURA KUNIO;NAKAYAMA TAKEHISA;TSUSHIMO KAZUNAGA;OWADA YOSHIHISA;HIRATA HISANORI;IZUMINA MASANOBU
分类号 H01L31/04;H01L21/20;H01L21/205;H01L21/31 主分类号 H01L31/04
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