| 摘要 |
PURPOSE:To eliminate the adherence of an excess plating by providing projections on both sides near the root of an external lead. CONSTITUTION:Projections 12 are formed on both sides near the root 11a of an external lead 11 of a lead frame 10. The thus formed frame 10 is placed on a rubber plate 6 to locally plate, and interposed by rubber mask 7 from upper surface. A gap between the projections 12 is blocked to prevent plating solution from the root side of the lead 11 from leaking. Thus, the plating is bonded onto the upper surface side of a pad 3 and the upper surface side of the root 11a of the lead 11, but not bonded to the preceding side from the projections 12. The thus plated frame 10 is used to form a semiconductor device. Since the exposed lead 11 is not bonded with plating in the device, there is no possibility of migration. |
