Electroplating composition and process and surfactant compound for use therein

摘要

Non-ionic surfactants prepared by reaction of ethoxylated bisphenols and sulfating agents such as sulfamic acid, sulfuric acid and chlorosulfonic acid are employed in metal electroplating baths and processes to increase the useful operating temperature limits of the baths in comparison to those using other non-ionic surfactants. The surfactants are particularly useful as additives in acid zinc electroplating baths, and especially acid zinc electroplating baths either completely devoid of ammonium ion or containing low amounts of ammonium ion.