| 摘要 |
PURPOSE:To relax the expansion and contraction of a metallic base by improving the adhesion of each layer of the title element by a method wherein an insulation resin layer is provided between a continuous conductive foil serving as the mount and the metallic base, and light emitting diodes are provided after the conductive foil is plated. CONSTITUTION:A substrate 10 having the base material of a metallic base includes the lamination of an insulation resin layer 12 over the whole surface of the metallic base 11 of aluminum or the like, the lamination of a continuous conductive foil 13, and two plated layers 14, 15 over the surface of this foil 13. Monolithic light emitting diodes 20, 20 disposed in an array are fixed on the conductive foil 13. The resin layer 12 absorbs the difference in coefficient of thermal expansion between the metallic base 11 and the conductive foil 13. Unlike other metallic substrates, the substrate 10 is so made that the coeffi cient of thermal expansion is: base > conductive foil >= plated layer. |
