| 摘要 |
<p>A transistor chip (1) is secured directly on to a metal plate (2), the collector of the transistor chip making direct electrical contact with the plate (2). In order to minimise the area of the plate (2) the emitter terminal (6) is arranged to overlie the collector terminal (7) with an intervening ceramic insulating layer (3). The base terminal (4) is separated from the other terminals by the chip (1) and is secured to an insulating layer (3) which in turn is secured to the plate (2). All the terminals have upright extensions for providing external connection. The device is normally enclosed in a resin material except for connecting portions of the upright terminal extensions.</p> |
