| 摘要 |
PURPOSE:To prevent a semiconductor element and its accessories from collecting dirt when exposed to a cooling wind and to improve the cooling effect of fins by a method wherein a wind shield is so installed between the heat transferring block and fins of a cooling device that air may be forced to go only through the fins. CONSTITUTION:Heated generated by a semiconductor element 6 in work causes the coolant in the heat transferring block belonging to a cooler 2 to boil, evaporate, and go up in a pipe 5a, to liquefy upon exposure to a cooling wind at the highest portion of the pipe 5a and come down the pipe 5a. Atmosphere is introduced into a chamber 24 through an inlet 15 located on the back side of a case 22, goes up in the chamber 24 contacting the fins 4 during its climb, to be blown out through an outlet by a cooling fan. In this process, due to a wind shield 25 provided to block the flow of air between a heat transferring block 3 and semiconductor element 6, the chamber 24 is shielded from a chamber 23 housing the semiconductor element 6 and others. This prevents the element 6 and its accessories from becoming dirty due to the cooling wind and improves the cooling effect of the fins 4. |
