AIRTIGHT BONDING PROCESS OF CERAMIC TERMINAL SHEET

摘要

PURPOSE:To provide the bonding process with excellent workability and high reliability by a method wherein a metallic material with thermal expansion coefficient fitting to that of ceramics is compositely bonded on the bonding part of metallic container to solder the metalized ceramic terminal sheet on the composite metal. CONSTITUTION:Metalized layers 11 are provided on the peripheral regions to be bonded below ceramic terminal sheet 8 using molybdenum.manganese. Firstly plated layers 12 made of boron.nickel is formed on the metalized layers 11 by means of non-electric field plating process. Secondly copal or metallic material 14 with thermal expansion coefficient fitting to that of ceramics 3 such as 42% Ni.Fe alloy is bonded on the region to be bonded with Alo alloy 13 comprising refrigerant container by means of explosion-pressure fixing process while the ceramic terminal sheet 8 is soldered on the metallic material 14 using tin.lead eutectic solder or low temperature solder. Through these procedures, the ceramic terminal sheet may be airtightly bonded with high reliability and no-cracking thereon since any unmatched thermal expansion coefficient may be eased up by means of bonding the ceramic terminal sheet 8 on the metallic material with thermal expansion coefficient fitting to that of ceramics laid between them.