| 摘要 |
PURPOSE:To prevent the breaking of an LSI chip by coating the surface of a chip loading metallic plate for an LSI-chip loading substrate with an electrical insulator. CONSTITUTION:A die section 22' for an LSI chip 22 loaded on an LSI package is insulated from a metallic plate 21' for the LSI package by an electrical insulator 29. An alumina material can be used generally as the electrical insulator 29, and the employment of an insulating materials, such as a beryllia material having low heat resistance, silicon carbide or the like is effective. Accordingly, the LSI chip 22 and the chip loading metallic plate 21' for an LSI-chip loading substrate are insulated completely by the electrical insulator 29, and the short-circuiting trouble of a power supply line can be prevented completely through the LSI chip in the LSI package, thus eliminating the breaking of the LSI chip. |
