| 摘要 |
An electroplating rack upon which an item to be plated is secured for immersion in a plating solution and in which electrical contact is made between the rack and the item by a clamp having a clamp screw and an opposed clamp pad, both the clamp screw and the clamp pad having a structure which provides the appropriate clamping forces and electrical connections while establishing seals for isolating the electrically conductive elements of the clamp from the plating solution. |
