发明名称 PACKAGE FOR LSI
摘要 PURPOSE:To prevent the breaking of an LSI chip on a short circuit by directly connecting an electric-supply terminal for an LSI-chip loading substrate and an LSI-chip loading metallic plate electrically. CONSTITUTION:Pin terminals 25 for feeding power supply are connected electrically to an LSI-chip loading metallic plate 21' by wirings 29 in a substrate, and the wirings 29 in the substrate can be realized easily by a formation through a through-hole printing technique. The electric resistance of the wirings 29 can further be reduced by shaping a plurality of the wirings 29. Accordingly, when a heat sink is brought into contact with a grounding section for a frame, etc. for an apparatus, short-circuit currents pass and flow through the wirings 29 in an LSI-chip loading substrate having a small resistance value, thus resulting in little currents passing through the inside of an LSI chip.
申请公布号 JPS61102746(A) 申请公布日期 1986.05.21
申请号 JP19840225419 申请日期 1984.10.26
申请人 NEC CORP 发明人 KADOMA YASUYUKI
分类号 H01L21/52;H01L21/58;H01L21/60 主分类号 H01L21/52
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