Polyamic acid copolymer system for improved semiconductor manufacturing

摘要

A polyamic acid copolymer forming a polyimide comprising, in mole percent, from greater than 5 percent to about 45 percent pyromellitic dianhydride, from about 5 percent to about 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.