| 摘要 |
PURPOSE:To make the total thickness of a device thinner and to improve mass production and economy without a defective product by making a construction wherein the bottom surfacesof a tape carrier and a semiconductor pellet are on the same plane. CONSTITUTION:A sticky tape 7 is tacked to cover an aperture 8 on the bottom surface of a tape carrier 1' which has the aperture 8 and a semiconductor pellet 2 is placed at the center o the aperture 8 and tacked on the sticky tape. Then, a wire bonding is carried out and the semiconductor pellet 2 and an inner lead 11 on the tape carrier 1' are electrically connected with a bonding wire 4 and a potting resin 5'' is filled. Then, a film pellet 6 is placed and the potting resin 5'' is hardened by heating whereby the tape carrier 1'', the semicon ductor pellet 2 and the film pellet 6 are mutually bonded by the formation of the potting resin 5'. At least, the sticky tape 7 is separated and a semiconduc tor device is obtained. |
