发明名称 COPPER ALLOY FOR BONDING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a copper wire for bonding which is useful and utilizable as a substitute for a gold wire, by incorporating trace amounts of 1 or >=2 kinds among Ti, Cr, Mn, Fe, Ni, and Co to high-purity Cu. CONSTITUTION:Among the elements in group IV of the periodic table, 1 of >=2 kinds among, by weight, 5-50ppm Ti, 5-50ppm Cr, 5-50ppm Fe, 10-100ppm to Co having a high purity of >=99.99%. Ti, Fe, Ni, and Co are useful for the improvement of thermal resistance, and Mn and Cr are also useful for the improvement of corrosion resistance.
申请公布号 JPS6199645(A) 申请公布日期 1986.05.17
申请号 JP19840221482 申请日期 1984.10.20
申请人 TANAKA DENSHI KOGYO KK 发明人 YOSHINAGA YASUHIKO;KURIHARA KENICHI;MUKOYAMA KOICHIRO
分类号 C22C9/00;B23K35/30;H01L21/60;H01L23/48 主分类号 C22C9/00
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