发明名称 DIAMOND TOOL MATERIAL
摘要 PURPOSE:To utilize the diamond layer without waste by forming the super hard alloy layer of diamond tool material wider than the diamond layer. CONSTITUTION:Diamond tool material 20 is composed of a diamond layer 22 of specific thickness and base material such as super hard alloy layer having larger thickness and diameter than those of the diamond layer 22 one face of which is brazed to one face of super hard alloy layer 24 thus to form the tool material integrally. Here, the diameter of the diamond layer 22 is substantially smaller than that of the super hard alloy layer 24. Consequently, the diamond layer 22 can be utilized completely except the cutting margin resulting in inexpensive diamond cutter.
申请公布号 JPS6190807(A) 申请公布日期 1986.05.09
申请号 JP19840211684 申请日期 1984.10.09
申请人 ORION KOGU SEISAKUSHO:KK 发明人 OSUMI KINYA
分类号 B23B27/20;B23B27/14;B23P15/28 主分类号 B23B27/20
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