发明名称 METHOD FOR SUBJECTING PLASTIC TO ELECTROLESS PLATING
摘要 <p>PURPOSE:To form plating having superior adhesion and a fine appearance on plastics by electroless plating by forming a film of a mixture of ABS resin with nitrile rubber on the surface of the plastics and carrying out etching and electroless plating. CONSTITUTION:A film 2 of a mixture of ABS resin with nitrile rubber is formed on the surface 1 of plastics to be subjected to electroless plating. The film 2 is chemically etched, known catalyst nuclei 3 are formed, and electroless plating 4 is carried out. Synthetic rubber such as chloroprene rubber or urethane rubber may be added to the nitrile rubber in the film 2 according to the kind of the plastics used as a base.</p>
申请公布号 JPS6191363(A) 申请公布日期 1986.05.09
申请号 JP19840213986 申请日期 1984.10.12
申请人 SEIKO EPSON CORP 发明人 TODA SHIGEO;ARAYA YUTAKA
分类号 C23C18/20;(IPC1-7):C23C18/20 主分类号 C23C18/20
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