发明名称 |
POSITIONED CHIP SURFACE COVERING |
摘要 |
The present invention relates to a process for preparing chip-containing decorative surfaces wherein the chips are positioned so as to provide a pattern. A first adhesive material is selectively applied to a support surface and the conditions are adjusted so that the first adhesive material is substantially non-adhesive in nature. A second adhesive material is selectively applied as a pattern on top of or adjacent to the first adhesive material and chips are applied to the surface so as to be adhered by the second adhesive material. Any non-adhered chips are removed and the conditons are adjusted so that the first adhesive material demonstrates adhesive properties. A second type or color of chip material is then applied so as to be adhered by the first adhesive material. Upon removal of the non-adhered chips, a product is obtained having a positioned chip pattern. The process may also be practiced using additional adhesives and chips so as to provide products having more than two types of positioned chips. |
申请公布号 |
AU4761085(A) |
申请公布日期 |
1986.05.08 |
申请号 |
AU19850047610 |
申请日期 |
1985.09.19 |
申请人 |
ARMSTRONG WORLD INDUSTRIES INC. |
发明人 |
LAWRENCE CLARK;HAROLD NELSON GRAYBEAL;JACK HENRY WITMAN |
分类号 |
B05D5/06;B44C1/04;B44F1/08;D06N7/00;D06N7/04 |
主分类号 |
B05D5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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