发明名称 BURNISHING METHOD
摘要 PURPOSE:To polish a base board surface and prevent its seizure, by immersing a tape in a solution, in which a lubricant is diluted with weak solution, to be impregnated with the solution thereafter supplying a new surface of the lapping tape of long scale, in a condition that the weak solution is evaporated, to a burnishing head. CONSTITUTION:In order to apply a lubricant 9 to a lapping tape T, the tape T is immersed in a solution 10 obtained by diluting the lubricant with weak solution, and the tape, after it is sufficiently impregnated with the solution, is dried by evaporating the weak solution. This tape T, in a condition that it is dried applying the lubricant 9, is fed from a feed roll 6 to a burnishing head 4 serving to finish a base board surface, and if the tape wears decreasing its polishing ability, a new surface of the tape is supplied to the burnishing head 4 by winding the worn tape to a reel roll 7. While the tape T, being pressed to the surface of a base board 1 while moving the head 4 in a radial direction of the base board 1, performs burnishing.
申请公布号 JPS6186169(A) 申请公布日期 1986.05.01
申请号 JP19840179042 申请日期 1984.08.28
申请人 FUJITSU LTD 发明人 WATANABE TAKASHI
分类号 B24B21/00;B24B21/04 主分类号 B24B21/00
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