Method for making a semiconductor device having conductor pins.

摘要

An improved package for a semiconductor device comprises an integrated circuit die and a mounting package having an array of parallel leads which directly connect perpendicular to the die. The process for making the package comprises forming an array of parallel, spaced apart, conductor pins; bonding the array of parallel conductor pins directly to an integrated circuit die while maintaining the die in a plane perpendicular to the parallel pins; and surrounding the die with a package material capable of protecting the die.