发明名称 SEAL-MOLDING DEVICE FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To enable the continuous manufacture of products molded by sealing, by a method wherein the ascent-descent and carriage of continuous lead frames, seal-molding of electronic components, separation of the runner and cull, and supply of the molding materials are processed automatically in a series. CONSTITUTION:When a carrier A is driven and a lead frame 2 is carried forward by the length of a molding die device C, the portion of the lead frame 2 not molded by sealing is located above the lower die 27, and the lead frame 2 having molded products 57 molded by sealing, runners, and culls comes above the die 58 of a runner-cull separator E. At this time, the carriage measure 20 of a material supplier D arranged at the side of the device C receives the molding materials 3 from a metering rotor 15 and feeds them to a pot 28, and the carrier A descends by reverse drive of an ascent cylinder 10; then, the lead frame 2 mounts on the lower die 27 and on the die 58. Accordingly, the cylinder 32 is driven and the upper die 33 descends and is clampled. Besides, a plunger 42 is raised and the molding materials 3 are cast from the pot 28 to a cavity 40, resulting in molding by sealing.
申请公布号 JPS6184840(A) 申请公布日期 1986.04.30
申请号 JP19840207371 申请日期 1984.10.03
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SHIBATA TERUYOSHI;MAMIYA HIROKUNI;NISHIKAWA CHUICHI
分类号 B29C39/10;B29C39/22;B29L31/34;H01L21/56 主分类号 B29C39/10
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