Gold electroplating bath for fabricating functional gold layers at high deposition rates

摘要

The invention relates to a gold electroplating bath for selectively depositing functional gold layers at high deposition rates. In this type of bath, different functional layers can be deposited without changing the composition of the bath components, solely by altering the concentration. The bath type is resistant to overheating, extraneous metal enrichment and oxidation, and it guarantees the deposition of gold layers which are stable up to 500 DEG C and have a minimum layer thickness of down to 0.1 mu m. These effects are achieved by adding a combination of a nitrogen-free phosphoric acid and a nitrogen-containing carboxylic acid.