| 摘要 |
PURPOSE:To prevent the generation of cracks by effectively utilizing the frame bed area and by uniformly dispersing the stress applied in mold resin sealing, by a method wherein holes penetrating in the thickness direction are bored in a frame bed where a semiconductor pellet is mounted, and a laminated member is placed so as to cover these holds; then, a semiconductor pellet is fixed thereon. CONSTITUTION:The frame bed 1 is a metallic plate which is punched out in an integral body with a lead frame, and through-holdes 3 are formed at the same time with this process of punch-out. A polyimide layer 2 is provided on this frame bed 1 so as to block the through-holes 3. The thickness of the polyimide layer 2 is set at approx. 100mum. A semiconductor pellet is fixed on this layer 2. Thus providing the frame bed 1 with the through-holes 3 can prevent the generation of cracks because of the effective diffusion of stress in mold resin sealing. Since the layer 2 blocks the through-holes 3, the adverse effect that the mounting agent to fix semiconductor pellets flows into the through-holes is not caused. |
