| 摘要 |
A method for manufacturing high capacitive multilayer conductive bars is described. It comprises at least two conductive elements (14,16), one capacitive element (12) between them, and further inner and/or outer dielectric elements (13,113,18,20). The electrical connection between the capacitive element (12) and the conductive element (14,16) is realized by a solder alloy material (30), preferably in the form of a soldering alloy material. The mechanical connection between the outer (18,20) respectively the inner dielectric elements (13,113) and the conductive elements (14,16) is established by a non-conductive bonding material (13',113',22,24). Mechanical as well as electrical connection is made in the same operation step. The multilayer conductive bar has a great reliability. It is used for power and/or signal distribution in electronics, for example printed circuits and other high density components.
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