发明名称 MOLD ASSEMBLY FOR ENCAPSULATING ELECTRONIC PARTS
摘要 PURPOSE:To obtain a mold assembly simple in operation, with less labor needed in operation, less time loss, and free from defective molding by providing a cavity between the top force and the bottom force and installing a pot to connect with the cavity on the bottom force. CONSTITUTION:As the mold piece 32 is located upward and opened, a lead frame with an electric part is inserted into the cavity 40, material is supplied into the pot 28 and then the clamping cylinder 32 is driven. Then, the top force falls with the upper 3rd mold plate 31 and collides with the bottom force 27. They are clamped to each other. The upper 1st mold plate 29 rises with the cylinder 32 and the plunger 42 rises through a synchronous rod and the plunger plate 36 to inject the material in the pot 28 into the cavity 40. Following the drive of the cylinder 32 performing the mold clamping, the material can be injected by the plunger 42 with simple operation and in short molding time without time loss. Additionally, there occurs no such erroneous molding opera tion as the case wherein material is injected by the plunger before a mold clamping.
申请公布号 JPS6184220(A) 申请公布日期 1986.04.28
申请号 JP19840207372 申请日期 1984.10.03
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SHIBATA TERUYOSHI;MAMIYA HIROKUNI;NISHIKAWA CHUICHI
分类号 H01L21/56;B29C45/02;B29C45/26;B29K105/20;B29L31/34 主分类号 H01L21/56
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