| 摘要 |
PURPOSE:To facilitate the exchange of defective elements and to improve the productivity by composing the circuit so that an element and wiring parts are connected by use of a substrate and a cap. CONSTITUTION:On a surface of a substrate 1, a die pad 2 and wiring parts 3 are formed. Meanwhile, a cap 4 comprises a recess and a wiring part 5 is formed in the recess. The wiring part 5 reaches a surface of the cap from the bottom of the recess through an inner wall of the recess and the connection part is formed. In such state, an element is put on the die pad 2 on the substrate 1 and is covered with the cap 4. As a result, it is possible to connect the element 6 with the wiring part 3 by wiring part 5. If there is a defective element 6, repair of the element can be done only by detaching the element from the die pad 2 of the substrate 1 and exchanging it. After that, the end parts are sealed by resin after connecting the substrate 1 and the cap 4 thereby protecting it from the atmosphere. |
