| 摘要 |
PURPOSE:To obtain a pin grid array type semiconductor device, pins therein can be increased and which is mounted easily, by erecting outer lead pins to a lead frame, molding the outer lead pins with a resin and projecting a large number of the outer lead pins from the bottom of a resin sealing body. CONSTITUTION:A semiconductor element 6 is fixed onto a tab 1 for a lead frame by a cementing material, and the element 6 and leads 2 are bonded by bonding wires 8. The tip section of outer lead pins 9 are inserted into the holes 3 of the lead pins 9 are inserted into the holes 3 of the lead frames, and molded with a resin to seal the semiconductor element 6, one parts of the lead frame and one parts of the outer lead pins 9 with the resin, thus forming a resin seal ing body 10. A large number of the outer lead pins 9 are projected form the base of the resin sealing body 10. A tie bar 4 is cut, and each lead frame is cut and separated, thus acquiring a semiconductor device. Accordingly, the number of the pins can be increased, and the semiconductor device can be shaped to a pin grid array type, thus resulting in easy mounting, then eliminating the need for a special mounting substrate. It is preferable that one row or more of the outer lead pins are erected on four side of the resin sealing body. |
