| 摘要 |
<p>LOW TEMPERATURE ELECTRONIC PACKAGE The invention is a right angle connection utilizing an interposer rod between horizontal and vertical substrates. The interposer rod is of insulating material and has a superconducting metal ground plane on its surface, which ground plane is in turn covered by an insulating film. Over the insulating film, the interposer has a number of arcuate conductors to which respective conductors of both the horizontal and vertical substrates are connected at controlled collapse pads. This provides good electrical and mechanical connection. All circuits are effectively transmission lines because the underlying ground plane is continuous. The interposer rod provides a robust, low inductance connector mechanism with a strain minimizing configuration, which low inductance connector mechanism permits both horizontal and vertical substrates to interconnect with great connection versatility, and with the opportunity for convenient removal and with great resistance to failure related to repeated temperature cycling. The interposer provides space for an array of connectors which permits the right angle connections to be closely spaced, at lithographic tolerances. Connections between circuits on the vertical substrate and circuits on the horizontal substrate are made by connecting first to a circuit on the interposer and then to the circuit on the other substrate. The equivalent circuit model is transmission line, small inductance at the first controlled collapse connection, transmission line on the interposer, small inductance at the second controlled collapse connection, transmission line.</p> |
