| 摘要 |
PURPOSE:To enable the title device equipped with a package of relatively large heat-disspation to be obtained without decreasing the moisture resistance, by a method wherein a heat sink to which a semiconductor element is die-bonded is adhered to inner leads to be wire-bonded to the semiconductor element, and both are sealed with a molding resin. CONSTITUTION:Inner leads 2 buried in the molding part 1 is made of thin plates of 42 Ni alloy, Cu series alloy, or Fe series alloy: at least wire-bonded tips are plated with metal. The heat sink 3 is adhered to the backs of the inner leads 2 via adhesive 4, and e.g. a ceramic plate is used for this heat sink 3. An epoxy series adhesive having heat resistance is used as the adhesive 4. A semiconductor element 5 is die-bonded to the center of the top of the heat sink 3 via Ag paste 6, and this element 5 is wire-bonded to required leads 2 with e.g. ultrafine Au wires. |
