发明名称 FORMING METHOD OF LEAD WIRE OF ELECTRONIC PARTS
摘要 PURPOSE:To form a lead wire of electronic parts in a short time and with a high efficiency by placing and bending the tip parts of the lead wire between two dies having an inclined part, twisting the bent tips and making them oppose to each other. CONSTITUTION:A lead wire 12 of a U-shape, etc. is fixed to a carrier tape 10 by an adhesive tape 13, etc. Tip parts 12a, 12b of the lead wire 12 are placed between metallic dies 30, 32, and bent parts 14a, 14b and different shape parts 16a, 16b are formed simultaneously. These bent parts 14a, 14b and different shape parts 16a, 16b are made to abut on one main surface of pushing pieces 46, 48 of jigs 42, 44. The jig 42 is turned clockwise by 90 deg., and subsequently, the jig 44 is turned counterclockwise by 90 deg., the tip parts 12a, 12b are twisted, respectively, and one tip part 12b is crossed and opposed to the upper side of the other tip part 12a.
申请公布号 JPS6171137(A) 申请公布日期 1986.04.12
申请号 JP19840193579 申请日期 1984.09.14
申请人 MURATA MFG CO LTD 发明人 MATSUDA SHIGEYOSHI
分类号 H05K13/04;B21F1/00;H01G13/00;H05K13/00 主分类号 H05K13/04
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